Application of diethylene glycol butyl ether_industrial additives

Background and overview[1-2]

Diethylene glycol butyl ether is a colorless liquid, soluble in water and oil. It is prepared by co-heating ethylene oxide and ethylene glycol butyl ether under pressure. Since the molecular structure of ethylene glycol monobutyl ether contains hydroxyl and ether bonds, it is both hydrophilic and lipophilic, and can be dissolved in water, methanol, ethanol, ether, acetone, benzene, carbon tetrachloride, heptane and other organic solvents and mineral.



More than 75% are used as solvents for coatings, inks, cleaning agents, etc. Its non-solvent uses include brake fluid, antifreeze and other chemical intermediates. It can be used as a solvent for nitrocellulose, varnish, resin, oil, etc.

1) Prepare an organic binder for silver paste on the back electrode of crystalline silicon photovoltaic cells. Its components according to the mass ratio: ethyl cellulose 1-10%, cellulose acetate butyrate 1-5%, diethyl Glycol butyl ether acetate 50-70%, diethylene glycol butyl ether 10-40%, dodecyl alcohol ester 1-5%, castor oil derivatives 0.1-0.5%, tallow allyl propylene diamine oleate 0.1-3%. The preparation method is: mix diethylene glycol butyl ether, diethylene glycol butyl ether acetate, ethyl cellulose, cellulose acetate butyrate, dodecyl alcohol ester, and hydrogenated castor oil derivatives, and heat to 80 ℃-90 ℃, constant temperature reaction for 1.5-2.5 hours. After complete dissolution, add tallow-based propylene diamine oleate, stir evenly, cool and filter to obtain an organic binder. The organic binder of the present invention is used to prepare the backside silver paste for crystalline silicon photovoltaic cells with good anti-settling effect, good fluidity and good screen printing performance.

2) Prepare a resistance slurry, which is prepared from the following raw materials by weight: 50-100 parts of conductive phase, 100-150 parts of inorganic phase, 200-500 parts of organic phase, and 25-50 parts of additives; Among them: the conductive phase is 20-30% flake graphite powder, 40-50% ruthenium dioxide powder, 50-60% nano silver powder; the inorganic phase is 22-60% silicon oxide, 13-30% calcium oxide, 5-23% Barium oxide, 12-28% antimony trioxide, 15-25% phosphorus pentoxide; the organic phase is 16-36% diethylene glycol butyl ether, 21-35% diethylene glycol butyl ether acetate, 18- Composed of 28% tributyl citrate, 7-12% ethyl cellulose, 6-18% hydrogenated castor oil, 0-8% polyamide wax, 18-30% silicone resin; additives are 16-55% nano Carbon-based conductive filler, 24-48% ultra-fine base metal alloy powder conductive filler; the resistance slurry of the present invention has strong adhesion to the base material and is resistant to aging. The resistance produced by the resistance slurry has been tested and analyzed to show resistance The performance is good, and the method has simple process requirements and low manufacturing cost.

3) Prepare a resistance slurry suitable for aluminum silicon carbide substrates. The resistance slurry includes the following materials: conductive phase 15%-30%, glass powder 43%-55%, organic phase 26%-34 %, additives 1%-3%; the conductive phase is composed of one, two or three kinds of micron silver powder, nano silver powder, and RuO2 powder; the glass powder is composed of silicon oxide, zinc oxide, bismuth oxide, boron oxide, and aluminum oxide and phosphorus pentoxide; the organic phase is composed of diethylene glycol butyl ether, diethylene glycol butyl ether acetate, dibutyl phthalate, tributyl citrate, and ethyl cellulose; the resistance slurry The lead content is 0 and the thermal properties are highly matched with the aluminum silicon carbide substrate and dielectric layer. The resistive layer formed by sintering does not peel or bubble, and has a strong bonding force with the dielectric layer. The preparation method includes: preparing glass powder, preparing organic phase, preparing resistance slurry, screen printing and sintering dielectric Eastman layer, screen printing and sintering resistance layer, measuring square resistance and re-sintering change rate.

4) Prepare a low-temperature co-fired ceramic powder paste for preparing LED substrates, including the following steps: (1) Mix calcium carbonate, silicon dioxide, boric acid, and zinc oxide, mix evenly, then melt and quench to obtain glass Crumbs, dry, crush, and sieve the glass crumbs to obtain glass powder; (2) Mix the glass powder and alumina powder, add deionized water and ball-mill, and the ball-milled slurry is sieved and dried. Dry to obtain low-temperature co-fired ceramic powder; (3) Thoroughly mix terpineol, castor oil, diethylene glycol butyl ether and diethylene glycol butyl ether acetate, then add polyvinyl butyral and dissolve to obtain a mixed organic Carrier, the mixed organic carrier and the low-temperature co-fired ceramic powder are mixed and ground to obtain a low-temperature co-fired ceramic powder paste. The low-temperature co-fired ceramic powder paste prepared by the present invention can be used on LEDs printed with silver circuits according to the design plan through the dispensing process.Various shapes are formed on the polycarbonate aluminum substrate, which brings great convenience and flexibility to LED light source design.

Main reference materials

[1] Dictionary of Organic Compounds

[2] Domestic market survey of ethylene glycol butyl ether

[3] CN201310486554.2 An organic binder for silver paste on the back electrode of free silicon dioxide crystalline silicon photovoltaic cells and its preparation method

[4] CN201711149290.6 Resistor slurry and preparation method

[5] CN201611174818.0 A resistance slurry adapted to aluminum silicon carbide substrate and its preparation method

[6] CN201310192449.8 A method of preparing low-temperature co-fired ceramic powder paste for LED substrates


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